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1

Model and forecast stock market behavior integrating investor sentiment analysis and transaction data

Zhang, Gaowei, Xu, Lingyu, Xue, Yunlan

Journal:

Cluster Computing

Year:

2017

Language:

english

File:

PDF, 4.68 MB

english, 2017

2

[IEEE 2019 IEEE 15th International Conference on Automation Science and Engineering (CASE) - Vancouver, BC, Canada (2019.8.22-2019.8.26)] 2019 IEEE 15th International Conference on Automation Science and Engineering (CASE) - Data-Driven Fault Diagnostics and Prognostics for Predictive Maintenance: A Brief Overview *

Xu, Gaowei, Liu, Min, Wang, Jingwei, Ma, Yumin, Wang, Jian, Li, Fei, Shen, Weiming

Year:

2019

Language:

english

File:

PDF, 131 KB

english, 2019

3

[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Simulation and optimization of X-band microstrip filters based on high-resistance silicon wafer with BCB dielectric and new shielding TSV structure

Wang, Wenhua, Zheng, Tao, Zhang, Weibo, Gai, Wei, Luo, Le, Xu, Gaowei

Year:

2017

Language:

english

File:

PDF, 508 KB

english, 2017

4

A novel mechanical diced trench structure for warpage reduction in wafer level packaging process

Zhu, Chunsheng, Li, Heng, Xu, Gaowei, Luo, Le

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.79 MB

english, 2015

5

High performance suspended spiral inductor and band-pass filter by wafer level packaging technology

Zheng, Tao, Xu, Gaowei, Luo, Le

Journal:

Microsystem Technologies

Year:

2017

Language:

english

File:

PDF, 2.50 MB

english, 2017

6

Process development of a novel wafer level packaging with TSV applied in high-frequency range transmission

Xiao Chen, Jiajie Tang, Gaowei Xu, Le Luo

Journal:

Microsystem Technologies

Year:

2013

Language:

english

File:

PDF, 773 KB

english, 2013

7

Influence of the Viscoelastic Properties of the Polyimide Dielectric Coating on the Wafer Warpage

Zhu, Chunsheng, Ning, Wenguo, Xu, Gaowei, Luo, Le

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 1.83 MB

english, 2014

8

Wafer level high-density trench capacitors by using a two-step trench-filling process

Zheng, Tao, Xu, Gaowei, Luo, Le

Journal:

Microsystem Technologies

Year:

2017

Language:

english

File:

PDF, 1.19 MB

english, 2017

9

Construction of Complex Network with Multiple Time Series Relevance

Huang, Zongwen, Xu, Lingyu, Wang, Lei, Zhang, Gaowei, Liu, Yaya

Journal:

Year:

2018

Language:

english

File:

PDF, 992 KB

english, 2018

10

Warpage and Reliability of a 3D-MCM on an Embedded Substrate With Multiple Interconnection Method

Gaowei Xu, Fei Geng, Qiuping Huang, Le Luo, Jian Zhou

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2010

Language:

english

File:

PDF, 2.12 MB

english, 2010

11

Heat-Transfer Characteristics and Design Optimization for a Small-Sized Plate-Fin Heat Sink Array

Xu, Gaowei, Cheng, Yingjun, Luo, Le

Journal:

Journal of Electronic Packaging

Year:

2007

Language:

english

File:

PDF, 386 KB

english, 2007

12

Void control during plating process and thermal annealing of through-mask electroplated copper interconnects

Zhu, Chunsheng, Ning, Wenguo, Li, Heng, Zheng, Tao, Xu, Gaowei, Luo, Le

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 1.54 MB

english, 2014

13

The complete mitochondrial genome of Accipiter virgatus and evolutionary history of the pseudo-control regions in Falconiformes

Song, Xuhao, Huang, Jie, Yan, Chaochao, Xu, Gaowei, Zhang, Xiuyue, Yue, Bisong

Journal:

Biochemical Systematics and Ecology

Year:

2015

Language:

english

File:

PDF, 1.47 MB

english, 2015

14

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Fabrication and microstructure evolution of preferred oriented nanotwinned copper by pulse electroplating for RDL in WLP

Lee, Heng, Ning, Wenguo, Zhu, Chunsheng, Xu, Gaowei, Luo, Le, Tian, Shenwu

Year:

2013

Language:

english

File:

PDF, 664 KB

english, 2013

15

Wafer-Level Packaging Design With Through Substrate Grooves as Interconnection for GaAs-Based Image Sensor

Wang, Shuangfu, Ye, Jiaotuo, Xu, Gaowei, Luo, Le

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 6.94 MB

english, 2013

16

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Experimental identification of warpage origination during the wafer level packaging process

Zhu, Chunsheng, Ning, Wenguo, Lee, Heng, Ye, Jiaotuo, Xu, Gaowei, Luo, Le

Year:

2014

Language:

english

File:

PDF, 2.76 MB

english, 2014

17

[IEEE 2014 IEEE/WIC/ACM International Joint Conferences on Web Intelligence (WI) and Intelligent Agent Technologies (IAT) - Warsaw, Poland (2014.8.11-2014.8.14)] 2014 IEEE/WIC/ACM International Joint Conferences on Web Intelligence (WI) and Intelligent Agent Technologies (IAT) - Recursive Deep Learning for Sentiment Analysis over Social Data

Li, Changliang, Xu, Bo, Wu, Gaowei, He, Saike, Tian, Guanhua, Hao, Hongwei

Year:

2014

Language:

english

File:

PDF, 460 KB

english, 2014

18

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Wafer level packaging for GaAs optical detector using through wafer grooves (TWG) fabricated by mechanical dicing and wet etching

Ye, Jiaotuo, Wang, Shuangfu, Zhu, Chunsheng, Xu, Gaowei, Luo, Le

Year:

2013

Language:

english

File:

PDF, 371 KB

english, 2013

19

Thermal analysis for indirect liquid cooled multichip module using computational fluid dynamic simulation and response surface methodology

Yingjun Cheng,, Gaowei Xu,, Dapeng Zhu,, Wenjie Zhu,, Luo, L.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2006

Language:

english

File:

PDF, 1.12 MB

english, 2006

20

Novel combined through-wafer-groove fabrication approach and its application in wafer level packaging of GaAs CCD

Ye, Jiaotuo, Wang, Shuangfu, Zhu, Chunsheng, Xu, Gaowei, Luo, Le

Journal:

Microsystem Technologies

Year:

2016

Language:

english

File:

PDF, 1.05 MB

english, 2016

21

Fabrication of a microstrip patch antenna integrated in low-resistance silicon wafer using a BCB dielectric

Wang, Tianxi, Han, Mei, Xu, Gaowei, Luo, Le

Journal:

Journal of Semiconductors

Year:

2013

Language:

english

File:

PDF, 507 KB

english, 2013

22

Investigation of Wet-Etching- and Multiinterconnection-Based TSV and Application in 3-D Hetero-Integration

Jiaotuo Ye,, Xiao Chen,, Gaowei Xu,, Le Luo,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 3.67 MB

english, 2014

23

Development of indium bumping technology through AZ9260 resist electroplating

Huang, Qiuping, Xu, Gaowei, Yuan, Yuan, Cheng, Xiao, Luo, Le

Journal:

Journal of Micromechanics and Microengineering

Year:

2010

Language:

english

File:

PDF, 1.40 MB

english, 2010

24

Design and fabrication of wafer level suspended high Q MIM capacitors for RF integrated passive devices

Zheng, Tao, Han, Mei, Xu, Gaowei, Luo, Le

Journal:

Microsystem Technologies

Year:

2017

Language:

english

File:

PDF, 1.54 MB

english, 2017

25

Event space model in virtual and real society based on special field

Xue, Yunlan, Xu, Lingyu, Yu, Jie, Wang, Lei, Zhang, Gaowei

Journal:

Concurrency and Computation: Practice and Experience

Year:

2016

Language:

english

File:

PDF, 1.60 MB

english, 2016

26

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - The Nonlinearity of Stress Evolution in Polymer-Metal Composite Thin Films During Thermal Treatment

Li, Heng, Cheng, Gong, Xu, Gaowei, Luo, Le

Year:

2016

Language:

english

File:

PDF, 461 KB

english, 2016

27

Train movement simulation by element increment method

Xu, Gaowei, Li, Feng, Long, Jiancheng, Han, Ding

Journal:

Journal of Advanced Transportation

Year:

2017

Language:

english

File:

PDF, 1.36 MB

english, 2017

28

Explore of warpage origination in WLP and processing influence factors by experiment and theoretical modeling

Li, Heng, Cheng, Gong, Xu, Gaowei, Luo, Le

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2016

Language:

english

File:

PDF, 2.54 MB

english, 2016

29

Key technology and application of millimeter wave communications for 5G: a survey

Xu, Xiaoling, Liu, Mei, Xiong, Jianbin, Lei, Gaowei

Journal:

Cluster Computing

Year:

2018

Language:

english

File:

PDF, 823 KB

english, 2018

30

[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Influence of observed anelasticity of Cu on the wafer warpage evolution during thermal processes

Cheng, Gong, Xu, Gaowei, Gai, Wei, Luo, Le

Year:

2018

Language:

english

File:

PDF, 3.78 MB

english, 2018

31

Bearing Fault Diagnosis Method Based on Deep Convolutional Neural Network and Random Forest Ensemble Learning

Xu, Gaowei, Liu, Min, Jiang, Zhuofu, Söffker, Dirk, Shen, Weiming

Journal:

Year:

2019

Language:

english

File:

PDF, 4.95 MB

english, 2019

32

Tensile strength of plain concrete under sustained load by PT machine

Xu, Gaowei, Komar, Andrew, Boyd, Andrew J.

Journal:

Construction and Building Materials

Year:

2019

Language:

english

File:

PDF, 2.24 MB

english, 2019

33

Growth performance and nutritional profile of mealworms reared on corn stover, soybean meal, and distillers’ grains

Zhang, Xia, Tang, Huaijian, Chen, Gaowei, Qiao, Linran, Li, Jinlong, Liu, Boxiang, Liu, Zhongdong, Li, Mengxing, Liu, Xu

Journal:

European Food Research and Technology

Year:

2019

Language:

english

File:

PDF, 710 KB

english, 2019

34

[IEEE 2019 IEEE 4th Advanced Information Technology, Electronic and Automation Control Conference (IAEAC) - Chengdu, China (2019.12.20-2019.12.22)] 2019 IEEE 4th Advanced Information Technology, Electronic and Automation Control Conference (IAEAC) - Autonomous Decision-Making Method for Combat Mission of UAV based on Deep Reinforcement Learning

Xu, Jie, Guo, Qing, Xiao, Lei, Li, Zhaoyi, Zhang, Gaowei

Year:

2019

File:

PDF, 5.08 MB

2019

35

Optimized highway deep learning network for fast single image super-resolution reconstruction

Ha, Viet Khanh, Ren, Jinchang, Xu, Xinying, Liao, Wenzhi, Zhao, Sophia, Ren, Jie, Yan, Gaowei

Journal:

Journal of Real-Time Image Processing

Year:

2020

File:

PDF, 2.08 MB

2020

36

Copper/benzocyclotene thin film technique based microstrip bandpass filter featured by thick dielectric layer for low insertion loss

Zhang, Weibo, Gu, Jiebin, Xu, Gaowei, Luo, Le, Li, Xinxin

Journal:

Microwave and Optical Technology Letters

Year:

2020

File:

PDF, 6.90 MB

2020

37

A NOVEL WL-INTEGRATED LOW-INSERTION-LOSS FILTER WITH SUSPENDED HIGH-Q SPIRAL INDUCTOR AND PATTERNED GROUND SHIELDS

Zheng, Tao, Han, Mei, Xu, Gaowei, Luo, Le

Journal:

Progress In Electromagnetics Research C

Year:

2015

File:

PDF, 697 KB

2015

38

Modeling the pullout behavior of fiber reinforced polymer bars from concrete

Xu Chang, Gaowei Yue, Haixiao Lin, Chunan Tang

Journal:

Construction and Building Materials

Year:

2010

Language:

english

File:

PDF, 659 KB

english, 2010

39

Soil Erosion Environmental Analysis of the Three Gorges Reservoir AreaBased on the “3S” Technology

Xu XiaoHua, Xu Xin-Fa, Lei Sheng, Fu ShaSha, Wu Gaowei

Journal:

Procedia Environmental Sciences

Year:

2011

Language:

english

File:

PDF, 3.00 MB

english, 2011

40

Development of wafer level glass frit bonding by using barrier trench technology and precision screen printing

Xiao Chen, Peili Yan, Jiajie Tang, Gaowei Xu, Le Luo

Journal:

Microelectronic Engineering

Year:

2012

Language:

english

File:

PDF, 1.25 MB

english, 2012

41

Enzymatic preparation of l-menthol by a high concentration substrate tolerable esterase from a newly isolated Bacillus subtilis ECU0554

Gaowei Zheng, Jiandong Zhang, Jianhe Xu

Journal:

Journal of Biotechnology

Year:

2008

Language:

english

File:

PDF, 69 KB

english, 2008

42

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - FEA study of the evolution of wafer warpage during reflow process in WLP

Zhu, Chunsheng, Ning, Wenguo, Ye, Jiaotuo, Xu, Gaowei, Luo, Le

Year:

2012

Language:

english

File:

PDF, 1.73 MB

english, 2012

43

Immobilization of highly active Pd nano-catalysts on functionalized mesoporous silica supports using mercapto groups as anchoring sites and their catalytic performance for phenol hydrogenation

Zhang, Jiaxi, Huang, Gaowei, Zhang, Cheng, He, Qunhua, Huang, Chao, Yang, Xu, Song, Huiyu, Liang, Zhenxing, Du, Li, Liao, Shijun

Journal:

Chinese Journal of Catalysis

Year:

2013

Language:

english

File:

PDF, 1.05 MB

english, 2013

44

Optimal design toward enhancement of thermomechanical reliability of polyimide layers in a flip-chip-on-lead-frame dual flat no-leads package with copper pillar bumps

Ning, Wenguo, Zhu, Chunsheng, Li, Heng, Xu, Gaowei, Luo, Le, Guo, Hongyan, Jing, Fei

Journal:

Materials Science in Semiconductor Processing

Year:

2013

Language:

english

File:

PDF, 887 KB

english, 2013

45

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Wafer level package of Wideband Microwave Transmission System and Integrated Microwave Antenna using BCB/Metal structure with the die embedded in Si substrate

Wang, Tianxi, Han, Mei, Xu, Gaowei, Luo, Le

Year:

2013

Language:

english

File:

PDF, 863 KB

english, 2013

46

[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Heat Transfer Characteristics of Small-Sized Plate-Fin Heat Sink Array in Supercomputer

Xu, Gaowei, Xue, Jianshun, Cheng, Yingjun, Zhu, Wenjie, Le Luo,

Year:

2006

Language:

english

File:

PDF, 6.43 MB

english, 2006

47

Stress evolution during thermal cycling of copper/polyimide layered structures

Zhu, Chunsheng, Ning, Wenguo, Xu, Gaowei, Luo, Le

Journal:

Materials Science in Semiconductor Processing

Year:

2014

Language:

english

File:

PDF, 1.59 MB

english, 2014

48

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - A novel MEMS package with three-dimensional stacked modules

Xu, Gaowei, Huang, Qiuping, Ning, Wenguo, Ruan, Zugang, Luo, Le

Year:

2009

Language:

english

File:

PDF, 923 KB

english, 2009

49

[IEEE 2007 IEEE International Conference on Granular Computing (GRC 2007) - Fremont, CA, USA (2007.11.2-2007.11.4)] 2007 IEEE International Conference on Granular Computing (GRC 2007) - Immune Evolution Algorithm Based Dynamic Path Planning Approach for the Soccer Robot

Xu, Xinying, Yan, Gaowei, Xie, Keming, Lin, T.Y.

Year:

2007

Language:

english

File:

PDF, 232 KB

english, 2007

50

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Wafer-level chip-to-Wafer (C2W) integration of high-sensitivity MEMS and ICs

Xu, Gaowei, Yan, Peili, Chen, Xiao, Ning, Wenguo, Luo, Le, Jiao, Jiwei

Year:

2011

Language:

english

File:

PDF, 3.30 MB

english, 2011

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